5. Thermal resistance characteristics
Items
Symbols
Conditions
Characteristics
min.
typ.
max.
Thermal resistance(1device)
Rth(j-c)
IGBT
FWD
-
-
0.125
-
-
0.23
Contact Thermal resistance
Rth(c-f) with Thermal Compound (※)
-
0.025
-
※ This is the value which is defined mounting on the additional cooling fin with thermal compound.
Units
℃/W
6. Indication on module
Logo of production
2MBI300U2B-060
300A 600V
Lot.No.
Place of manufacturing (code)
7.Applicable category
This specification is applied to IGBT Module named 2MBI300U2B-060 .
8.Storage and transportation notes
・ The module should be stored at a standard temperature of 5 to 35℃ and humidity of 45 to 75% .
・ Store modules in a place with few temperature changes in order to avoid condensation on the module surface.
・ Avoid exposure to corrosive gases and dust.
・ Avoid excessive external force on the module.
・ Store modules with unprocessed terminals.
・ Do not drop or otherwise shock the modules when transporting.
9. Definitions of switching time
L
RG
VGE
V CE
Ic
10. Packing and Labeling
Display on the packing box
- Logo of production
- Type name
- Lot No
- Products quantity in a packing box
0V
V GE
VCE
Vcc
0V Ic
0A
90%
trr
90%
Irr
Ic
10%
10%
tr(i)
tr
ton
VCE
toff
0V
90%
10%
tf
MS5F 5617
a
5
13
H04-004-03a