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AK8998W Ver la hoja de datos (PDF) - Asahi Kasei Microdevices
Número de pieza
componentes Descripción
Lista de partido
AK8998W
Pressure sensor interface IC that features compensation for temperature drift and sensor variation
Asahi Kasei Microdevices
AK8998W Datasheet PDF : 59 Pages
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[AK8998/W/D]
Pin Configuration
1. Wafer Configuration
1) Die size
2) Die thickness
3) PAD size
4) PAD pitch
5) Scribe size
6) Wafer size
2.082mm x 1.662mm
280µm
80µm x 80µm
150µm<
80µm
6 inch
Pin numbers and Pad position
No. Pin Name
1 VSS
2 VO
3 VOUT
4 VDD
5 AGND
6 N.C.
7 N.C.
8 N.C.
X Location
(µm)
-894.8
-894.8
-894.8
-894.8
-521.7
Y Location No. Pin Name
(µm)
687.2
9 CSCLK
337.8
10 DET1
-344.7 11 DET2/PTH
-687.1 12 N.C.
-684.8 13 VN
14 VS
15 VP
16 EXTMP
X Location
(µm)
894.8
894.8
894.8
749.3
363.4
-236.7
-716.4
Y Location
(µm)
-544.7
-242.5
-57.9
684.8
684.8
684.8
684.8
Pad locations (Top view)
1 16
15
14
13
2
Y
X
11
(0,0)
3
10
4
5
9
2. Package Outline (UQFN16)
13 VN
14 VS
15 VP
16 EXTMP
8 N.C.
7 N.C.
6 N.C.
5 AGND
MSxxxxx-E-00
-4-
2012/11
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