TL084BCP Ver la hoja de datos (PDF) - STMicroelectronics
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TL084BCP Datasheet PDF : 16 Pages
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TL084
5
Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 25. TSSOP14 package mechanical data
Dimensions
Ref.
Millimeters
Min.
Typ.
Max.
Min.
A
1.2
A1
0.05
0.15
0.002
A2
0.8
1
1.05
0.031
b
0.19
0.30
0.007
c
0.09
0.20
0.004
D
4.9
5
5.1
0.193
E
6.2
6.4
6.6
0.244
E1
4.3
4.4
4.48
0.169
e
0.65 BSC
K
0°
8°
0°
L
0.45
0.60
0.75
0.018
Inches
Typ.
0.004
0.039
0.197
0.252
0.173
0.0256 BSC
0.024
Max.
0.047
0.006
0.041
0.012
0.0089
0.201
0.260
0.176
8°
0.030
A A2
A1 b
e
c
D
K
L
E
E1
PIN 1 IDENTIFICATION
1
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