BAV70,215(2015) Ver la hoja de datos (PDF) - NXP Semiconductors.

Número de pieza

componentes Descripción

Lista de partido

BAV70,215
(Rev.:2015)

High-speed switching diodes

NXP Semiconductors. 

NXP Semiconductors

BAV70 series

High-speed switching diodes

2.2

1.2

(2×)

1.4

(2×)

4.6 2.6

1.4

solder lands

solder resist

occupied area

Dimensions in mm

preferred transport direction during soldering

2.8

4.5

sot023_fw

Fig 13. Wave soldering footprint BAV70 (SOT23/TO-236AB)

1.3

0.7

R0.05 (12×)

0.9

0.25

(2×)

0.3

(2×)

0.4

(2×)

0.6 0.7

0.3

0.4

Reflow soldering is the only recommended soldering method.

Fig 14. Reflow soldering footprint BAV70M (SOT883/SC-101)

solder lands

solder resist

solder paste

occupied area

Dimensions in mm

sot883_fr

BAV70_SER

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 8 — 18 March 2015

© NXP Semiconductors N.V. 2015. All rights reserved.

10 of 16

Share Link: