74ABT827 Ver la hoja de datos (PDF) - NXP Semiconductors.
Número de pieza
componentes Descripción
Lista de partido
74ABT827 Datasheet PDF : 14 Pages
| |||
NXP Semiconductors
74ABT827
10-bit buffer/line driver; non-inverting; 3-state
12. Package outline
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
y
Z
24
c
13
E
A
X
HE
vM A
pin 1 index
1
e
12
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1) E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25 0.25
0.1
0.9
0.4
8o
inches
0.1
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.61
0.60
0.30
0.29
0.05
0.419
0.394
0.055
0.043
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
0o
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
OUTLINE
VERSION
SOT137-1
IEC
075E05
REFERENCES
JEDEC
JEITA
MS-013
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 8. Package outline SOT137-1 (SO24)
74ABT827_3
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 24 February 2010
© NXP B.V. 2010. All rights reserved.
8 of 14
Share Link: 