H11L1-M Ver la hoja de datos (PDF) - Fairchild Semiconductor
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H11L1-M Datasheet PDF : 8 Pages
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6-PIN DIP
OPTOISOLATORS LOGIC OUTPUT
H11L1M
H11L2M
H11L3M
Package Dimensions (Through Hole)
0.350 (8.89)
0.320 (8.13)
Package Dimensions (Surface Mount)
0.350 (8.89)
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
0.260 (6.60)
0.240 (6.10)
0.390 (9.90)
0.332 (8.43)
0.070 (1.77)
0.040 (1.02)
0.200 (5.08)
0.115 (2.93)
0.014 (0.36)
0.010 (0.25)
0.320 (8.13)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 (2.54)
15°
0.012 (0.30)
Package Dimensions (0.4”Lead Spacing)
0.350 (8.89)
0.320 (8.13)
0.070 (1.77)
0.040 (1.02)
0.200 (5.08)
0.115 (2.93)
0.025 (0.63)
0.020 (0.51)
0.020 (0.50)
0.016 (0.41)
0.014 (0.36)
0.010 (0.25)
0.320 (8.13)
0.012 (0.30)
0.008 (0.20)
0.100 [2.54]
0.035 (0.88)
0.006 (0.16)
Recommended Pad Layout for
Surface Mount Leadform
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 [2.54]
0.012 (0.30)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
NOTE
All dimensions are in inches (millimeters)
0.070 (1.78)
0.060 (1.52)
0.425 (10.79)
0.100 (2.54)
0.305 (7.75)
0.030 (0.76)
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6 OF 8
11/01/01 DS300222
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