LTC1659IMS8-PBF Ver la hoja de datos (PDF) - Linear Technology

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LTC1659IMS8-PBF

12-Bit Rail-to-Rail Micropower DAC in MSOP Package

Linear Technology 

PACKAGE DESCRIPTION

MS8 Package

8-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1660 Rev F)

0.889 ± 0.127

(.035 ± .005)

LTC1659

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.42 ± 0.038

(.0165 ± .0015)

TYP

0.65

(.0256)

BSC

RECOMMENDED SOLDER PAD LAYOUT

3.00 ± 0.102

(.118 ± .004)

(NOTE 3)

8 7 65

0.52

(.0205)

REF

0.254

(.010)

DETAIL “A”

0° – 6° TYP

4.90 ± 0.152

(.193 ± .006)

3.00 ± 0.102

(.118 ± .004)

(NOTE 4)

GAUGE PLANE

0.18

(.007)

0.53 ± 0.152

(.021 ± .006)

DETAIL “A”

1 234

1.10

(.043)

MAX

SEATING

PLANE 0.22 – 0.38

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

(.009 – .015)

TYP

0.65

(.0256)

BSC

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.86

(.034)

REF

0.1016 ± 0.0508

(.004 ± .002)

MSOP (MS8) 0307 REV F

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

1659fa

11

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