UT54LVDSC032-UPX Ver la hoja de datos (PDF) - Aeroflex UTMC
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UT54LVDSC032-UPX Datasheet PDF : 11 Pages
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AC SWITCHING CHARACTERISTICS1, 2, 3, 4
(VDD = +5.0V + 10%, TA = -55 °C to +125 °C)
SYMBOL
PARAMETER
tPHLD
Differential Propagation Delay High to Low
CL = 20pf (figures 4 and 5)
tPLHD
Differential Propagation Delay Low to High
CL = 20pf (figures 4 and 5)
tSKD
Differential Skew (tPHLD - tPLHD) (figures 4 and 5)
tSK
4
1
Channel-to-Channel Skew1 (figures 4 and 5)
tSK
4
2
Chip-to-Chip Skew5 (figures 4 and 5)
tTLH4
Rise Time (figures 4 and 5)
tTHL4
Fall Time (figures 4 and 5)
tPH
4
Z
Disable Time High to Z (figures 6 and 7)
tPLZ 4
Disable Time Low to Z (figures 6 and 7)
tPZ
4
H
Enable Time Z to High (figures 6 and 7)
tPZL 4
Enable Time Z to Low (figures 6 and 7)
MIN
1.0
1.0
0
0
MAX
8.0
8.0
3.0
3.0
7.0
2.0
2.0
20
20
20
20
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Notes:
1. Channel-to-Channel Skew is defined as the difference between the propagation delay of the channel and the other channels in the same chip with an event on the inputs.
2. Generator waveform for all tests unless otherwise specified: f = 1 MHz, Z0 = 50 Ω, tr and tf (0% - 100%) < 1ns for R IN and tr and tf < 6ns for EN or EN.
3. CL includes probe and jig capacitance.
4. Guaranteed by characterization.
5. Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays.
6
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