HCTS93D Ver la hoja de datos (PDF) - Intersil

Número de pieza

componentes Descripción

Lista de partido

HCTS93D

Radiation Hardened 4-Bit Binary Ripple Counter

Intersil 

HCTS93MS

Die Characteristics

DIE DIMENSIONS:

89 x 88 mils

2.25mm x 2.24mm

METALLIZATION:

Type: AlSi

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCTS93MS

MR1

CP1

CP0

(2)

(1)

(14)

MR2 (3)

NC (4)

(13) NC

(12) Q0

(11) Q3

(10) GND

VCC (5)

(9) Q1

(6)

(7)

(8)

NC

NC

Q2

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS93 is TA14454A.

Spec Number 518622

488

Share Link: