HCS164D Ver la hoja de datos (PDF) - Intersil

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HCS164D

Radiation Hardened 8-Bit Serial-In/Parallel-Out Register

Intersil 

HCS164MS

Die Characteristics

DIE DIMENSIONS:

95 x 94mils

METALLIZATION:

Type: AlSi

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

< 2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCS164MS

DS2

DS1

VCC

Q7

Q6

(2)

(1)

(14)

(13)

(12)

Q0 (3)

Q1 (4)

NC

(11) Q5

NC

(10) Q4

(5)

(6)

(7)

(8)

Q2

Q3

GND

CP

238

(9)

(MR)

Spec Number 518756

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