HCTS08D Ver la hoja de datos (PDF) - Intersil

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HCTS08D

Radiation Hardened Quad 2-Input AND Gate

Intersil 

Die Characteristics

DIE DIMENSIONS:

87 x 88 mils

2.20 x 2.24mm

METALLIZATION:

Type: SiAl

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

B1 (2)

HCTS08MS

HCTS08MS

A1

VCC

B4

(1)

(14)

(13)

Y1 (3)

A2 (4)

B2 (5)

(6)

(7)

(8)

Y2

GND

Y3

(12) A4

(11) Y4

(10) B3

(9) A3

Spec Number 518842

8

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