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5962F9568901VXC

Radiation Hardened Quad Differential Line Receiver

Intersil 

Die Characteristics

DIE DIMENSIONS:

84 mils x 130 mils

(2140µm x 3290µm)

INTERFACE MATERIALS:

Glassivation:

Type: SiO2

Thickness: 10kÅ ± 1kÅ

Metallization Mask Layout

HS-26C32RH

Top Metallization:

M1: Mo/Tiw

Thickness: 5800Å

M2: Al/Si/Cu

Thickness: 5800Å

Worst Case Current Density:

<2.0 x 105A/cm2

Bond Pad Size:

110µm x 100µm

HS-26C32RH

AIN

VDD

BIN

(1)

(16)

(15)

AIN (2)

(14) BIN

AOUT (3)

ENAB (4)

COUT (5)

CIN (6)

(13) BOUT

(12) ENAB

(11) DOUT

(10) DIN

(7)

(8)

(9)

CIN

GND

DIN

4

FN3402.4

August 1, 2008

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