HCTS163D Ver la hoja de datos (PDF) - Intersil

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HCTS163D

Radiation Hardened Synchronous Counter

Intersil 

Die Characteristics

DIE DIMENSIONS:

104 x 86 mils

METALLIZATION:

Type: AlSi

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

< 2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCTS163MS

HCTS163MS

CP

MR

VCC

(2)

(1)

(16)

P0 (3)

P1 (4)

P2 (5)

P3 (6)

(15) TC

(14) Q0

(13) Q1

(12) Q2

PE (7)

(11) Q3

(8)

(9)

(10)

GND

SPE

TE

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS163 is TA14448A.

Spec Number 518600

578

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