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Número de pieza
componentes Descripción
TESVSP0A225M8L Ver la hoja de datos (PDF) - NEC => Renesas Technology
Número de pieza
componentes Descripción
fabricante
TESVSP0A225M8L
Surface mount resin molded, Ultra miniaturized chip
NEC => Renesas Technology
TESVSP0A225M8L Datasheet PDF : 16 Pages
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TAPE AND REEL SPECIFICATION
[Carrier Tape Specification and Packing Quantity]
sprocket hole
D
0
embossed cavity
B
0
SVS SERIES
E
FW
t
A
0
P
1
P
2
P
0
K
Feed direction
A
0
±
0.2
1.4
B
0
±
0.2
2.2
W
±
0.3
8.0
F
±
0.05
3.5
E
±
0.1
1.75
P
1
±
0.1 P
2
±
0.05 P
0
±
0.1
4.0
2.0
4.0
D
0
+0.1
0
φ
1.5
K
±
0.2
1.4
(Unit : mm)
t
Q'ty / Reel
0.2
3000
[Reel Specification]
B
D
R
W
1
CNA
W
2
Tape width
8
A
φ
178
±
2.0
N
φ
50 min.
C
φ
13
±
0.5
D
φ
21
±
0.5
B
2.0
±
0.5
W
1
10.0
±
1.0
W
2
14.5 max.
(Unit : mm)
R
1
5
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