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TDA7515

RF front-end for AM/FM-DSP car radios with IF sampling

STMicroelectronics 

TDA7515

3

Package information

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 3. LQFP44 (10x10) Mechanical data & package dimensions

Obsolete

) DIM.

MIN.

mm

TYP. MAX. MIN.

inch

TYP. MAX.

t(s A

1.60

0.063

c A1 0.05

0.15 0.002

0.006

u A2 1.35 1.40 1.45 0.053 0.055 0.057

d B 0.30 0.37 0.45 0.012 0.015 0.018

ro C 0.09

0.20 0.004

0.008

P D 11.80 12.00 12.20 0.464 0.472 0.480

te D1 9.80 10.00 10.20 0.386 0.394 0.401

le D3

8.00

0.315

o E 11.80 12.00 12.20 0.464 0.472 0.480

bs E1 9.80 10.00 10.20 0.386 0.394 0.401

E3

8.00

0.315

- O e

0.80

0.031

) L 0.45 0.60 0.75 0.018 0.024 0.030

t(s L1

1.00

0.039

c k

0˚(min.), 3.5˚(typ.), 7˚(max.)

Produ ccc

0.10

0.0039

OUTLINE AND

MECHANICAL DATA

LQFP44 (10 x 10 x 1.4mm)

0076922 E

5/7

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