MSM6996H Ver la hoja de datos (PDF) - Oki Electric Industry

Número de pieza

componentes Descripción

Lista de partido

MSM6996H

Single Chip CODEC

Oki Electric Industry 

¡ Semiconductor

PACKAGE DIMENSIONS

DIP16-P-300-2.54

MSM6996H/6996V/6997H/6997V/6998/6999

(Unit : mm)

Package material

Lead frame material

Pin treatment

Solder plate thickness

Package weight (g)

Epoxy resin

42 alloy

Solder plating

5 mm or more

0.99 TYP.

19/21

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