IC555 Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Lista de partido
IC555 Datasheet PDF : 14 Pages
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Physical Dimensions
8-DIP
A
(.092) [Ø2.337]
PIN #1
[ ] .400 10.15
.373 9.46
.036 [0.9 TYP]
.250±.005 [6.35±0.13]
(.032) [R0.813]
PIN #1
TOP VIEW
OPTION 1
7° TYP
B
[ ] .070 1.78
.045 1.14
.310±.010 [7.87±0.25]
.130±.005 [3.3±0.13]
.210 MAX
[5.33]
7° TYP
TOP VIEW
OPTION 2
C
[ ] .021 0.53
.015 0.37
.001[.025] C
.015 MIN
[0.38]
[ ] .140 3.55
.125 3.17
.100
[2.54]
NOTES:
A. CONFORMS TO JEDEC REGISTRATION MS-001,
VARIATIONS BA
B. CONTROLING DIMENSIONS ARE IN INCHES
REFERENCE DIMENSIONS ARE IN MILLIMETERS
C. DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED
.010 INCHES OR 0.25MM.
D. DOES NOT INCLUDE DAMBAR PROTRUSIONS.
DAMBAR PROTRUSIONS SHALL NOT EXCEED
.010 INCHES OR 0.25MM.
E. DIMENSIONING AND TOLERANCING
PER ASME Y14.5M-1994.
.300
[7.62]
.430 MAX
[10.92]
.060 MAX
[1.52]
[ ] .010+-..000005 0.254+-00..010207
N08EREVG
Figure 16. 8-Lead, DIP, JEDEC MS-001, 300" WIDE
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:
http://www.fairchildsemi.com/products/discrete/pdf/8dip_tr.pdf.
© 2002 Fairchild Semiconductor Corporation
LM555 Rev. 1.1.0
11
www.fairchildsemi.com
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