LSD20463 Ver la hoja de datos (PDF) - Conexant Systems
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LSD20463 Datasheet PDF : 68 Pages
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SmartHCF Mobile Modem Designer’s Guide
5.3.2 DAA Section............................................................................................................................... 5-6
DAA Isolation Gap............................................................................................................. 5-6
DAA Section Grounding .................................................................................................... 5-7
DIB Interface ..................................................................................................................... 5-7
DC Hold and Impedance Match Interface ......................................................................... 5-7
Diode Bridge ..................................................................................................................... 5-7
VC and VREF Circuit ........................................................................................................ 5-7
Telephone Line Interface .................................................................................................. 5-7
Handset Interface (Optional) ............................................................................................. 5-8
5.4 PACKAGE DIMENSIONS....................................................................................................................... 5-11
6. HOST SOFTWARE INTERFACE ....................................................................................................................... 6-1
6.1 PCI CONFIGURATION REGISTERS....................................................................................................... 6-1
6.1.1 0x00 - Vendor ID Field ............................................................................................................... 6-2
6.1.2 0x02 - Device ID Field................................................................................................................ 6-2
6.1.3 0x04 - Command Register ......................................................................................................... 6-2
6.1.4 0x06 - Status Register ............................................................................................................... 6-3
6.1.5 0x08 - Revision ID Field............................................................................................................. 6-3
6.1.6 0x09 - Class Code Field............................................................................................................. 6-3
6.1.7 0x0D - Latency Timer Register .................................................................................................. 6-3
6.1.8 0x0E - Header Type Field .......................................................................................................... 6-3
6.1.9 0x28 - CIS Pointer Register ....................................................................................................... 6-3
6.1.10 0x2C - Subsystem Vendor ID Register ...................................................................................... 6-4
6.1.11 0x2E- Subsystem ID Register .................................................................................................... 6-4
6.1.12 0x34 - Cap Ptr ............................................................................................................................ 6-4
6.1.13 0x3C - Interrupt Line Register .................................................................................................... 6-4
6.1.14 0x3D - Interrupt Pin Register...................................................................................................... 6-4
6.1.15 0x3E - Min Grant Register.......................................................................................................... 6-4
6.1.16 0x3F - Max Latency Register ..................................................................................................... 6-4
6.1.17 0x40 - Capability Identifier ......................................................................................................... 6-4
6.1.18 0x41 - Next Item Pointer ............................................................................................................ 6-4
6.1.19 0x42 - PMC - Power Management Capabilities ......................................................................... 6-5
6.1.20 0x44 - PMCSR - Power Management Control/Status Register (Offset = 4)............................... 6-5
6.1.21 0x46 - PMCSR_BSE - PMCSR PCI to PCI Bridge Support Extensions..................................... 6-6
6.1.22 0x47 - Data ................................................................................................................................ 6-6
6.2 BASE ADDRESS REGISTER .................................................................................................................. 6-6
6.3 SERIAL EEPROM INTERFACE ............................................................................................................... 6-7
6.3.1 Supported EEPROM Sizes ........................................................................................................ 6-7
6.3.2 Definitions .................................................................................................................................. 6-8
Device ID Register ............................................................................................................ 6-8
Vendor ID Register............................................................................................................ 6-8
Subsystem Vendor ID and Subsystem Device Register ................................................... 6-8
Min_Gnt Register .............................................................................................................. 6-8
Max_Lat Register .............................................................................................................. 6-9
PMC [8:6] and PME DRV Type ......................................................................................... 6-9
Class Code Register (Class Code, Sub-class Code, Prog. I/F) ........................................ 6-9
CardBus CIS Pointer (CardBus CIS pointer High, CardBus CIS pointer Low).................. 6-9
Data Register (D3, D2, D1, D0 power consumed and D3, D2, D1, D0 power
dissipated)......................................................................................................................... 6-9
Load CISRAM Count (CIS _SIZE) .................................................................................... 6-9
100475A
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