SM5908 Ver la hoja de datos (PDF) - STMicroelectronics
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SM5908 Datasheet PDF : 6 Pages
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1N5908/SM5908
Fig. 4 : Capacitance versus reverse applied
voltage (typical values).
Fig. 5 : Peak forward voltage drop versus peak
forward current.
Fig. 6a/6b : Transient thermal impedance junction-ambientversus pulse duration.
Fig. 6a : CB429 Package.
(For FR4 PC Board with L lead = 10 mm)
Fig. 6b : SMC Package.
Mounting on FR4 PC Board with recommended
pad layout.
Fig. 7 : Relative variation of leakage current
versus junction temperature.
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