BGF125 Ver la hoja de datos (PDF) - Infineon Technologies

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BGF125

SIM Card Interface Filter and ESD Protection

Infineon Technologies 

Footprint

BGF125

SIM Card Interface Filter and ESD Protection

BGF125

0.8

0.4

Figure 5

0.25

WLP-8-10-N-FP V02

Recommended PCB pad design for reflow soldering

Tape

4

0.25

1.33

Pin 1

Corner Index Area

0.75

WLP-8-10-N-TP V01

Figure 6 Tape for BGF125 / WLP-8-10

You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”:

http://www.infineon.com/products.

Data Sheet

7

V2.0, 2009-04-01

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