LB66B1-77B Ver la hoja de datos (PDF) - Unspecified
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LB66B1-77B Datasheet PDF : 2 Pages
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METAL CASE, CASE-MOUNTED
SEMICONDUCTORS
Part Number Series LB66B1
Natural Conv. (°C/W): 17.1
Forced Air (°C/W): 5.3
Mounting Envelope: 1.40" x 1.12" x .50"
Series LB66B1
Technical
DESCRIPTION OF CURVES
A. N.C. Horiz. Device Only
Mounted to G-10.
B. N.C Horiz. & Vert. With
Dissipator.
C. 200 FPM w/Diss.
D. 500 FPM w/Diss.
E. 1000 FPM w/Diss.
• Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound.
• Derate 1.4 °C/watt for unplated part in natural convection only.
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