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BLF245 Ver la hoja de datos (PDF) - NXP Semiconductors.

Número de pieza
componentes Descripción
Lista de partido
BLF245
NXP
NXP Semiconductors. NXP
BLF245 Datasheet PDF : 16 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Philips Semiconductors
VHF power MOS transistor
Product specification
BLF245
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 60134).
SYMBOL
VDS
VGS
ID
Ptot
Tstg
Tj
PARAMETER
drain-source voltage
gate-source voltage
drain current (DC)
total power dissipation
storage temperature
junction temperature
CONDITIONS
VGS = 0
VDS = 0
Tmb 25 °C
MIN.
65
MAX. UNIT
65
V
±20 V
6
A
68
W
150 °C
200 °C
THERMAL CHARACTERISTICS
SYMBOL
Rth j-mb
Rth mb-h
PARAMETER
CONDITIONS
thermal resistance from junction to mounting base Tmb = 25 °C; Ptot = 68 W
thermal resistance from mounting base to heatsink Tmb = 25 °C; Ptot = 68 W
VALUE
2.6
0.3
UNIT
K/W
K/W
10
handbook, halfpage
ID
(A)
(1)
1
MRA921
(2)
101
1
10
102
VDS (V)
(1) Current is this area may be limited by RDSon.
(2) Tmb = 25 °C.
Fig.2 DC SOAR.
handboo1k,0h0alfpage
Ptot
(W)
80
(2)
60
(1)
40
20
0
0
40
80
MGP167
120
160
Th (°C)
(1) Continuous operation.
(2) Short-time operation during mismatch.
Fig.3 Power derating curves.
2003 Sep 02
3

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