MAX44245AUD Ver la hoja de datos (PDF) - Maxim Integrated
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MAX44245AUD Datasheet PDF : 13 Pages
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MAX44244/MAX44245/MAX44248
36V, Precision, Low-Power, 90µA,
Single/Quad/Dual Op Amps
ABSOLUTE MAXIMUM RATINGS
VDD to VSS.............................................................-0.3V to +40V
Common-Mode Input Voltage.........(VSS - 0.3V) to (VDD + 0.3V)
Differential Input Voltage IN_+, IN_- .......................................6V
Continuous Input Current Into Any Pin............................ Q20mA
Output Voltage to VSS (OUT_).................– 0.3V to (VDD + 0.3V)
Output Short-Circuit Duration (OUT_)...................................... 1s
Operating Temperature Range......................... -40NC to +125NC
Storage Temperature........................................ -65NC to +150NC
Junction Temperature......................................................+150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
SO-8
TSSOP
Junction-to-Ambient Thermal Resistance (BJA).........132NC/W
Junction-to-Case Thermal Resistance (BJC)................38NC/W
SO-14
Junction-to-Ambient Thermal Resistance (BJA).........110NC/W
Junction-to-Case Thermal Resistance (BJC)................30NC/W
FMAX
Junction-to-Ambient Thermal Resistance (BJA).........120NC/W
Junction-to-Case Thermal Resistance (BJC)................37NC/W
SOT23
Junction-to-Ambient Thermal Resistance (BJA)......206.3NC/W
Junction-to-Case Thermal Resistance (BJC)................42NC/W
Junction-to-Ambient Thermal Resistance (BJA)......324.3NC/W
Junction-to-Case Thermal Resistance (BJC)................82NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VDD = 10V, VSS = 0V, VIN+ = VIN- = VDD/2, RL = 5kI to VDD/2, TA = -40NC to +125NC, unless otherwise noted. Typical values are
at +25NC.) (Note 2)
PARAMETER
POWER SUPPLY
Supply Voltage Range
Power-Supply Rejection Ratio
(Note 3)
Quiescent Current per Amplifier
DC SPECIFICATIONS
SYMBOL
CONDITIONS
VDD
PSRR
IDD
Guaranteed by PSRR
TA = +25NC, VIN+ = VIN- = VDD/2 - 1V
-40NC < TA < +125NC
TA = +25NC
-40NC < TA < +125NC
Input Common-Mode Range
VCM
Guaranteed by CMRR test
MIN TYP MAX UNITS
2.7
36
V
140 148
dB
133
90
130
FA
145
VSS -
0.05
VDD -
1.5
V
Common-Mode Rejection Ratio
(Note 3)
CMRR
TA = +25NC, VCM = VSS - 0.05V to VDD -
1.5V
-40NC < TA < +125NC, VCM = VSS - 0.05V
to VDD - 1.5V
126
120
130
dB
Input Offset Voltage (Note 3)
VOS
TA = +25NC
-40NC < TA < +125NC
2
7.5
FV
10
Input Offset Voltage Drift
(Note 3)
TC VOS
10
30 nV/NC
Maxim Integrated
2
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