datasheetbank_Logo
búsqueda de Hoja de datos y gratuito Fichas de descarga

STPS30150C(2010) Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza
componentes Descripción
Lista de partido
STPS30150C
(Rev.:2010)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STPS30150C Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
STPS30150C
Characteristics
Figure 11. Forward voltage drop versus
Figure 12. Thermal resistance junction to
forward current (maximum values,
per diode)
ambient versus copper surface
under tab for D2PAK
IFM(A)
100.0
Tj=125°C
(maximum values)
10.0
1.0
Tj=125°C
(typical values)
Tj=25°C
(maximum values)
Rth(j-a)(°C/W)
80
70
60
50
40
30
20
Epoxy printed circuit board FR4,
copper thickness: 35µm
VFM(V)
0.1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
10
0
0
S(Cu)(cm²)
5
10
15
20
25
30
35
40
Doc ID 7757 Rev 8
5/11

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]