FS61429-01
1-PLL LVPECL Clock Generator IC
AMERICAN MICROSYSTEMS, INC.
Preliminary Information
November 2000
4.0 Package Information
Table 7: 28-pin SOIC (0.300") Package Dimensions
DIMENSIONS
INCHES
MILLIMETERS
MIN. MAX. MIN. MAX.
A 0.0926 0.1043 2.35
2.65
A1 0.0040 0.0118 0.10
0.30
b 0.0130 0.0200 0.33
0.51
C 0.0091 0.0125 0.23
0.32
D 0.6969 0.7125 17.70 18.10
E 0.2914 0.2992 7.40
7.60
e
0.050 BSC
1.27 BSC
H 0.394 0.419 10.00 10.65
h 0.010 0.029 0.25
0.75
L 0.016 0.050 0.40
1.27
α
0°
8°
0°
8°
28
EH
AMERICAN MICROSYSTEMS, INC.
1
e
b
h x 45°
BASE PLANE
Acα
D
SEATING PLANE A1
L
Table 8: 28-pin SOIC (0.300") Package Characteristics
PARAMETER
Thermal Impedance, Junction to Free-Air
Lead Inductance, Self
Lead Inductance, Mutual
Lead Capacitance, Bulk
Lead Capacitance, Mutual
SYMBOL
ΘJA
L11
L12
L13
C11
C12
C13
CONDITIONS/DESCRIPTION
Air flow = 0 m/s, single-layer PCB
Corner lead, plus wire
Center lead, plus wire
Corner lead plus wire, to first adjacent lead
Center lead plus wire, to first adjacent lead
Corner lead plus wire, to next adjacent lead
Center lead plus wire, to next adjacent lead
Any corner lead plus wire to VSS
Any center lead plus wire to VSS
Any corner lead plus wire to first adjacent lead
Any center lead plus wire to first adjacent lead
Any corner lead plus wire to next adjacent lead
Any center lead plus wire to next adjacent lead
TYP.
77
5.914
2.187
2.240
0.647
1.108
0.366
1.173
0.419
0.463
0.084
0.045
0.013
UNITS
°C/W
nH
nH
pF
pF
ISO9001
QS9000
6