OZ6933 Ver la hoja de datos (PDF) - O2Micro International

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componentes Descripción

Lista de partido

OZ6933

ACPI CardBus Controller

O2Micro International 

208 PIN – BGA

OZ6933

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.

2. "e" REPRESENTS THE SOLDER BALL GRID PITCH.

3. "N" REPRESENTS THE MAXIMUM NUMBER OF SOLDER BALLS FOR MATRIX SIZE

M1 AND M2.

4. DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER AFTER

REFLOW AND PARALLEL TO PRIMARY DATUM Z, THE ORIGINAL SOLDER BALL

DIAMETER IS 0.45 mm.

5. PRIMARY DATUM Z AND SEATING PLANE ARE DEFINED BY THE SPHERICAL

CROWNS OF THE SOLDER BALLS.

6. A1 CORNER MUST BE IDENTIFIED BY INK MARK, METALLIZED MARKINGS,

IDENTATION OR OTHER FEATURE OF PACKAGE BODY, LID OR INTEGRAL

HEATSLUG, ON THE TOP SURFACE OF THE PACKAGE.

7. SOLDER BALL DEPOPULATION IS ALLOWED. DEPOPULATION IS THE OMISSION OF

BALLS FROM A FULL MATRIX (M1 OR M2).

8. BALL PAD A1 CORNER INDICATOR (NC) SOLDER BALL

OZ6933-SF-1.7

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