FDC37C67X Ver la hoja de datos (PDF) - SMSC -> Microchip

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FDC37C67X

Enhanced Super I/O Controller with Fast IR

SMSC -> Microchip 

D

D1

E

E1

e

W

A

A2

H

0.10

-C-

A1

DIM

A

A1

A2

D

D1

E

E1

H

L

L1

e

0

W

TD(1)

TE(1)

TD(2)

TE(2)

MIN

MAX

2.80

3.15

0.1

0.45

2.57

2.87

23.4

24.15

19.9

20.1

17.4

18.15

13.9

14.1

0.1

0.2

0.65

0.95

1.8

2.6

0.65 BSC

0°

12°

.2

.4

21.8

22.2

15.8

16.2

22.21

22.76

16.27

16.82

TD/TE

MIN

MAX

.110

.124

.004

.018

.101

.113

.921

.951

.783

.791

.685

.715

.547

.555

.004

.008

.026

.037

.071

.102

.0256 BSC

0°

12°

.008

.016

.858

.874

.622

.638

.874

.896

.641

.662

0

L

L1

Notes:

1) Coplanarity is 0.100mm (.004") maximum.

2) Tolerance on the position of the leads is

0.200mm (.008") maximum.

3) Package body dimensions D1 and E1 do not

include the mold protrusion. Maximum mold

protrusion is 0.25mm (.010").

4) Dimensions TD and TE are important for testing

by robotic handler. Only above combinations of (1)

or (2) are acceptable.

5) Controlling dimension: millimeter. Dimensions

in inches for reference only and not necessarily

accurate.

FIGURE 24 - 100 PIN QFP PACKAGE OUTLINE

193

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