COM20051ILJ Ver la hoja de datos (PDF) - SMSC -> Microchip

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COM20051ILJ

Integrated Microcontroller and ARCNET (ANSI 878.1) Interface

SMSC -> Microchip 

INDEX CORNER

D

D1

G x 45°

SEE DETAIL A

F x 45°

E E1

-E-

E3/D3 E2/D2

e

-D-

.007 E D

J x 45°, 3 places

DETAIL A

SEATING

B1

PLANE

B2

-C-

C

R

A1

A

.004

-C-

SEATING PLANE

B

DIM

A

A1

B

B1

B2

C

D/E

D1/E1

D2/E2

D3/E3

e

F

G

J

R

44 LEAD

.160-.188

.090-.120

.013-.021

.026-.032

.025 MIN

.020-.045

.685-.695

.650-.656

.600-.630

.500 REF

.050 BSC

.042-.060

.042-.048

.000-.028

.025-.045

Notes:

1. Dimensions are in inches.

2. Coplanarity is .004" maximum.

3. Tolerance on the position of the leads is .007" maximum.

4. Package body dimensions D1 and E1 do not include the mold protrusion.

Maximum mold protrusion is .010".

FIGURE 31 – 44 PIN PLCC PACKAGE DIMENSIONS

SMSC DS – COM20051I

Page 74

Rev. 03/27/2000

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