CY2309 Ver la hoja de datos (PDF) - Cypress Semiconductor
Número de pieza
componentes Descripción
Lista de partido
CY2309 Datasheet PDF : 14 Pages
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CY2305
CY2309
Package Drawing and Dimensions
8 Lead (150 Mil) SOIC - S80-l8ead (150-Mil) SOIC S8
PIN 1 ID
4
1
0.150[3.810]
0.157[3.987]
0.230[5.842]
0.244[6.197]
1. DIMENSIONS IN INCHES[MM] MIN.
MAX.
2. PIN 1 ID IS OPTIONAL,
ROUND ON SINGLE LEADFRAME
RECTANGULAR ON MATRIX LEADFRAME
3. REFERENCE JEDEC MS-012
4. PACKAGE WEIGHT 0.07gms
5
8
PART #
S08.15 STANDARD PKG.
SZ08.15 LEAD FREE PKG.
0.189[4.800]
0.196[4.978]
SEATING PLANE
0.010[0.254] X 45°
0.016[0.406]
0.050[1.270]
BSC
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.004[0.102]
0°~8°
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
51-85066-*C
16 Lead (150 Mil) SOIC
8
9
16-Lead (150-Mil) SOIC S16
PIN 1 ID
1
DIMENSIONS IN INCHES[MM] MIN.
0.150[3.810]
0.157[3.987]
0.230[5.842]
0.244[6.197]
16
REFERENCE JEDEC MS-012
PACKAGE WEIGHT 0.15gms
PART #
S16.15 STANDARD PKG.
SZ16.15 LEAD FREE PKG.
MAX.
0.386[9.804]
0.393[9.982]
0.050[1.270]
BSC
0.0138[0.350]
0.0192[0.487]
SEATING PLANE
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.004[0.102]
0.0098[0.249]
0° ~8°
0.010[0.254] X 45°
0.016[0.406]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
51-85068-*B
Document #: 38-07140 Rev. *G
Page 12 of 14
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