HA-2500/883 Ver la hoja de datos (PDF) - Intersil
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HA-2500/883 Datasheet PDF : 7 Pages
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HA-2500/883
Die Characteristics
DIE DIMENSIONS:
57 x 65 x 19 milss
1450 x 1650 x 483µm
METALLIZATION:
Type: Al, 1% Cu
Thickness: 16kÅ ± 2kÅ
GLASSIVATION:
Type: Nitride (Si3N4) over Silox (SiO2, 5% Phos.)
Silox Thickness: 12kÅ ± 2kÅ
Nitride Thickness: 3.5kÅ ± 1.5kÅ
WORST CASE CURRENT DENSITY:
0.3 x 105A/cm2
SUBSTRATE POTENTIAL (Powered Up):
Unbiased
TRANSISTOR COUNT:
HA-2500/883: 40
PROCESS: Bipolar Dielectric Isolation
Metallization Mask Layout
HA-2500/883
+IN -IN
BAL
COMP
V-
V+
BAL
OUT
Spec Number 511002-883
5
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