MAX2078CTK(2009) Ver la hoja de datos (PDF) - Maxim Integrated
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MAX2078CTK Datasheet PDF : 25 Pages
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Octal-Channel Ultrasound Front-End
with CW Doppler Mixers
ABSOLUTE MAXIMUM RATINGS
VCC_ to GND .........................................................-0.3V to +5.5V
VCC2 - VCC1 .....................................................................> -0.3V
CI_, CQ_ to GND ....................................................-0.3V to +13V
ZF_, IN_, AG to GND ..................................-0.3V to (VCC + 0.3V)
INC_ ..............................................................................20mA DC
VREF to GND.............................................................-0.3V to +3V
IN_ to AG ...............................................................-0.6V to +0.6V
OUT_, LO_, DIN, DOUT, VG_, NP, CS, CLK, PD,
CLP, V/C to GND .....................................-0.3V to VCC1 + 0.3V
CI_, CQ_, VCC_, VREF analog and digital control signals must
be applied in this order
Input Differential Voltage ................................2.0VP-P differential
Continuous Power Dissipation (TA = +70°C)
68-Pin TQFN (derated 40mW/°C above +70°C) ..................4W
Operating Temperature Range (Note 1A) ..............0°C to +70°C
Junction Temperature ......................................................+150°C
θJC (Note 1B, 1C) .........................................................+0.3°C/W
θJA (Note 1C, 1D) ..........................................................+20°C/W
Storage Temperature Range .............................-40°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1A:
Note 1B:
Note 1C:
Note 1D:
TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.
Junction temperature TJ = TC + (θJC x VCC x ICC). This formula can only be used if the component is soldered down to a
printed circuit board pad containing multiple ground vias to remove the heat. The junction temperature must not exceed
150°C.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Junction temperature TJ = TA + (θJA x VCC x ICC), assuming there is no heat removal from the exposed pad. The junction
temperature must not exceed 150°C.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, VREF = 2.475V to 2.525V, VCC1 = 3.13V to 3.47V, VCC2 = 4.5V to 5.25V, TA = 0°C to +70°C, VGND = 0V,
CLP = 0, PD = 0, no RF signals applied. Typical values are at VCC1 = 3.3V, VCC2 = 4.75V, TA = +25°C, unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
3.3V Supply Voltage
4.75V/5V Supply Voltage
External Reference Voltage Range
CMOS Input High Voltage
CMOS Input Low Voltage
VCC1
VCC2
VREF
VIH
VIL
(Note 3)
Applies to CMOS control inputs
Applies to CMOS control inputs
3.13
3.3
3.47
V
4.5
4.75 5.25
V
2.475
2.525
V
2.5
V
0.8
V
CMOS Input Leakage Current
IIN
TA = +25oC, applies to CMOS control inputs;
input current = 0V, output current = 3.47V
10
µA
DATA Output High Voltage
DATA Output Low Voltage
DOUT_HI 10MΩ load
DOUT_LO 10MΩ load
VCC1
V
0
V
DC ELECTRICAL CHARACTERISTICS—VGA MODE
(Typical Application Circuit, VREF = 2.475V to 2.525V, VCC1 = 3.13V to 3.47V, VCC2 = 4.5V to 5.25V, TA = 0°C to +70°C, VGND = 0V,
NP = 0, V/C = 1, CLP = 0, PD = 0, no RF signals applied. Typical values are at VCC1 = 3.3V, VCC2 = 4.75V, TA = +25°C, unless other-
wise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
4.75V/5V Supply Standby Current I_NP_5V_TOT NP = 1, all channels
3.9
6
mA
3V Supply Standby Current
4.75V/5V Power-Down Current
I_NP_3V_TOT NP = 1, all channels
I_PD_5V_TOT PD = 1, all channels
1.7
3
mA
0.4
10
µA
3V Power-Down Current
3V Supply Current per Channel
I_PD_3V_TOT PD = VCC1, all channels
I_3V_NM
Total I divided by 8, VG+ - VG1 = -2V
0.3
10
µA
11
16
mA
4.75V/5V Supply Current per
Channel
I_5V_NM Total I divided by 8
6.0
8.3
mA
DC Power per Channel
P_NM
64.8 92.3 mW
2 _______________________________________________________________________________________
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