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MAX7360ETL

I2C-Interfaced Key-Switch Controller and LED Driver/GPIOs with Integrated ESD Protection

Maxim Integrated 

I2C-Interfaced Key-Switch Controller and LED

Driver/GPIOs with Integrated ESD Protection

ABSOLUTE MAXIMUM RATINGS

VCC to GND............................................................. -0.3V to +4V

COL0–COL7, ROW0–ROW7 to GND....................... -0.3V to +4V

SDA, SCL, AD0, INTI, INTK to GND......................... -0.3V to +6V

PORT0–PORT7 to GND.......................................... -0.3V to +16V

All Other Pins to GND................................ -0.3V to (VCC + 0.3V)

DC Current on PORT0–PORT7, COL2–COL7.....................25mA

GND Current.......................................................................80mA

Continuous Power Dissipation (TA = +70NC)

40-Pin TQFN (derate 22.2mW/NC above +70NC).......1777mW

36-Bump WLP (derate 21.7mW/NC above +70NC).....1739mW

Junction-to-Case Thermal Resistance (BJC) (Note 1)

40-Pin TQFN...................................................................2NC/W

36-Bump WLP.................................................................... N/A

Junction-to-Ambient Thermal Resistance (BJA) (Note 1)

40-Pin TQFN.................................................................45NC/W

36-Bump WLP..............................................................46NC/W

Operating Temperature Range........................... -40NC to +85NC

Junction Temperature......................................................+150NC

Storage Temperature Range............................ -65NC to +150NC

ESD Protection

Human Body Model (RD = 1.5kI, CS = 100pF)

All Pins.............................................................................Q2kV

IEC61000-4-2 (RD = 330I, CS = 150pF)

Contact Discharge

ROW0–ROW7, COL0–COL7, PORT0–PORT7 to GND....Q8kV

Air-Gap Discharge

ROW0–ROW7, COL0–COL7, PORT0–PORT7 to GND..Q15kV

Lead Temperature (soldering, 10s)

40-Pin TQFN.................................................................+300NC

36-Bump WLP............................................................ (Note 2)

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a single-

.layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Note 2: Refer to Pb-free solder-reflow requirements described in J-STD-020, Rev D.1, or any other paste supplier specification.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

ELECTRICAL CHARACTERISTICS

(VCC = +1.62V to +3.6V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VCC = +3.3V, TA = +25NC.) (Notes 3, 4)

PARAMETER

Operating Supply Voltage

External Supply Voltage

PORT0–PORT7

SYMBOL

VCC

VPORT_

CONDITIONS

MIN TYP MAX UNITS

1.62 3.3

3.6

V

14

V

Operating Supply Current

Sleep-Mode Supply Current

Key-Switch Source Current

Key-Switch Source Voltage

Key-Switch Resistance

Startup Time from Shutdown

Output Low Voltage

COL2–COL7

ICC

ISL

IKEY

VKEY

RKEY

tSTART

VOL

All key switches open, oscillator running,

COL2–COL7 configured as key switches,

VPORT_ = VCC

N keys pressed

(Note 5)

ISINK = 10mA

34

50

FA

34 +

20 x N

1.3

3

FA

20

35

FA

0.43 0.5

V

5

kI

2

2.4

ms

0.5

V

Oscillator Frequency (PWM

Clock)

fOSC

TA = +25NC, VCC = +2.61V

TA = TMIN - TMAX, VCC P 3.6V

125 128 131

kHz

102

164

Oscillator Frequency Variation

DfOSC TA = +25NC

-6

+8.5

%

Key-Scan Frequency

fKEY Derived from oscillator clock

64

kHz

2   _______________________________________________________________________________________

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