MC74HC373A Ver la hoja de datos (PDF) - ON Semiconductor
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MC74HC373A Datasheet PDF : 8 Pages
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DEVICE
UNDER
TEST
TEST POINT
OUTPUT
CL*
*Includes all probe and jig capacitance
Figure 5.
MC74HC373A
TEST CIRCUITS
DEVICE
UNDER
TEST
TEST POINT
OUTPUT
1 kΩ
CL*
CONNECT TO VCC WHEN
TESTING tPLZ AND tPZL.
CONNECT TO GND WHEN
TESTING tPHZ AND tPZH.
*Includes all probe and jig capacitance
Figure 6.
EXPANDED LOGIC DIAGRAM
D0
3
DQ
D1
4
DQ
D2
7
DQ
D3
8
DQ
D4
13
DQ
D5
14
DQ
D6
17
DQ
D7
18
DQ
LE
LE
LE
LE
LE
LE
LE
LE
11
1
2
5
6
9
12
15
16
19
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
–A–
20
1
–T–
SEATING
PLANE
E
G
F
PACKAGE DIMENSIONS
PDIP–20
N SUFFIX
PLASTIC DIP PACKAGE
CASE 738–03
ISSUE E
11
B
10
C
L
K
N
D 20 PL
0.25 (0.010) M T A M
M
J 20 PL
0.25 (0.010) M
TBM
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 1.010 1.070 25.66 27.17
B 0.240 0.260 6.10 6.60
C 0.150 0.180 3.81 4.57
D 0.015 0.022 0.39 0.55
E
0.050 BSC
1.27 BSC
F 0.050 0.070 1.27 1.77
G 0.100 BSC
2.54 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.140 2.80 3.55
L
0.300 BSC
7.62 BSC
M
0_ 15_ 0_ 15_
N 0.020 0.040 0.51 1.01
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