MSC1157 Ver la hoja de datos (PDF) - Oki Electric Industry
Número de pieza
componentes Descripción
Lista de partido
MSC1157 Datasheet PDF : 14 Pages
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¡ Semiconductor
PAD CONFIGURATION
Pad Layout
Chip size
Chip thickness
Pad size (PV aperture)
Substrate potential
Pad location diagram
: X=2.3mm, Y=2.4mm
: 350±30mm
: 110¥110mm
: GND
Y-Axis
2
1
8
7
MSC1157
X-Axis
3
6
5
4
Pad Coordinates
(Chip center is located at X=0 and Y=0.)
Pad No.
1
2
3
4
5
6
7
8
Pad Name
VR
AIN
SP
GND
VCC
SP
STBY
SEL
X-AXIS
–133
–985
–950
–180
240
950
985
159
(Unit: µm)
Y-AXIS
1035
1035
–263
–1027
–914
–263
1035
1035
11/13
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