¡ Semiconductor
APPLICATION CIRCUIT
MSM6926/6946
Notes: 1.
2.
3.
4.
The crystal should be wired in close physical proximity to the device.
High level signals should not be routed next to low level signals.
Bypass capacitors on VA, SG1, and SG2 should be as close to the device as possible.
AG and DG should be connected as close to the system ground as possible.
Figure 8 Application Circuit Using MSM6926RS/MSM6946RS
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