TEMD5010X01 Ver la hoja de datos (PDF) - Vishay Semiconductors
Número de pieza
componentes Descripción
Lista de partido
TEMD5010X01 Datasheet PDF : 7 Pages
| |||
TEMD5010X01
Vishay Semiconductors
Silicon PIN Photodiode
SOLDER PROFILE
300
250
255 °C
240 °C
217 °C
200
150
max. 120 s
100
max. 260 °C
245 °C
max. 30 s
max. 100 s
50 max. ramp up 3 °C/s max. ramp down 6 °C/s
0
0
50 100 150 200 250 300
19841
Time (s)
Fig. 8 - Lead (Pb)-free Reflow Solder Profile
acc. J-STD-020D
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Time between soldering and removing from MBB must not
exceed the time indicated in J-STD-020:
Moisture sensitivity: level 4
Floor life: 72 h
Conditions: Tamb < 30 °C, RH < 60 %
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or
recommended conditions:
192 h at 40 °C (+ 5 °C), RH < 5 %
or
96 h at 60 °C (+ 5 °C), RH < 5 %.
www.vishay.com
448
For technical questions, contact: detectortechsupport@vishay.com
Document Number: 84679
Rev. 1.4, 12-May-09
Share Link: 