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AOZ1010 Ver la hoja de datos (PDF) - Alpha and Omega Semiconductor

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Lista de partido
AOZ1010
AOSMD
Alpha and Omega Semiconductor AOSMD
AOZ1010 Datasheet PDF : 14 Pages
First Prev 11 12 13 14
AOZ1010
The junction to ambient temperature can be got from
power dissipation in the AOZ1010 and thermal imped-
ance from junction to ambient.
T (jun-amb) = (PtotallossPinductorloss) × ΘJA
The maximum junction temperature of AOZ1010 is
145°C, which limits the maximum load current capability.
Please see the thermal de-rating curves for the maximum
load current of the AOZ1010 under different ambient
temperatures.
The thermal performance of the AOZ1010 is strongly
affected by the PCB layout. Extra care should be taken
by users during the design process to ensure that the IC
will operate under the recommended environmental
conditions.
Several layout tips are listed below for the best electric
and thermal performance. Figure 3 below illustrates a
single layer PCB layout example as a reference.
1. Do not use thermal relief connection to the VIN and
the PGND pin. Pour a maximized copper area to
the PGND pin and the VIN pin to help thermal
dissipation.
2. Input capacitor should be connected to the VIN pin
and the PGND pin as close as possible.
3. A ground plane is preferred. If a ground plane is not
used, separate PGND from AGND and connect them
only at one point to avoid the PGND pin noise
coupling to the AGND pin. In this case, a decoupling
capacitor should be connected between VIN pin and
AGND pin.
4. Make the current trace from LX pins to L to Co to the
PGND as short as possible.
5. Pour copper plane on all unused board area and
connect it to stable DC nodes, like VIN, GND, or VOUT.
6. The two LX pins are connected to the internal PFET
drain. They are low resistance thermal conduction
path and most noisy switching node. Connect a
copper plane to the LX pin to help thermal
dissipation. This copper plane should not be too
large otherwise switching noise may be coupled to
other parts of the circuit.
7. Keep sensitive signal traces such as trace connect-
ing FB pin and COMP pin away from the LX pins.
Cin PGND 1
8
VIN 2 SO-8 7
Cd
AGND 3
6
R2
FB
4
5
R1
Cc Rc
LX Cout
LX L
EN
COMP
Figure 3. AOZ1010 PCB Layout
Rev. 1.0 November 2006
www.aosmd.com
Page 11 of 14

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