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RT8271GFP Ver la hoja de datos (PDF) - Richtek Technology

Número de pieza
componentes Descripción
Lista de partido
RT8271GFP
Richtek
Richtek Technology Richtek
RT8271GFP Datasheet PDF : 15 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
RT8271
Parameter
Logic High
EN Input Voltage
Logic Low
Enable Pull Up Current
Shutdown Current
Quiescent Current
Soft-Start Period
Thermal Shutdown
Symbol
Test Conditions
ISHDN
IQ
TSD
VEN = 0V
VEN = 0V
VEN = 2V, VFB = 1V
CSS = 10nF
Min Typ Max Unit
1.4
-- 5.5
V
--
-- 0.4
--
1
-- μA
--
22 36 μA
-- 0.6 1 mA
--
1
-- ms
-- 150 -- °C
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θJA is measured in the natural convection at TA = 25°C on a high effective thermal conductivity four layers test board of
JEDEC 51-7 thermal measurement standard. The case point of θJC is on the expose pad for MSOP-10 (Exposed Pad)
package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
DS8271-02 March 2011
www.richtek.com
5

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