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XC6206P Ver la hoja de datos (PDF) - TOREX SEMICONDUCTOR

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XC6206P Datasheet PDF : 17 Pages
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XC6206 Series
PIN CONFIGURATION
*The dissipation pad for the USP-6B
package should be solder-plated in
recommended mount pattern and
metal masking so as to enhance
mounting strength and heat release.
If the pad needs to be connected to
other pins, it should be connected to
the pin number 4 (VIN).
(TOP VIEW)
PIN ASSIGNMENT
SOT-23
1
3
2
-
PIN NUMBER
SOT-89/TO-92 (T) USP-6B
1
2
2
4
3
6
-
1, 3, 5
TO-92 (L)
2
1
3
-
PIN NAME
VSS
VIN
VOUT
NC
FUNCTIONS
Ground
Power Input
Output
No Connection
PRODUCT CLASSIFICATION
Ordering Information
XC6206P ①②③④⑤
DESIGNATOR DESCRIPTION
SYMBOL
DESCRIPTION
①②
Output Voltage
Accuracy
Packages
Device Orientation
* +1% accuracy can be set at VOUT(T) > 2.0V.
12~50
2
1*
M
P
D
T
L
R
L
H
B
: e.g. VOUT: 3.0V→①=3, =0
: Within + 2% (within +30mV when VOUT<1.5V)
: Within +1%
: SOT-23
: SOT-89
: USP-6B
: TO-92 (T type)
: TO-92 (L type) (Discontinued Product)
: Embossed tape, standard feed
: Embossed tape, reverse feed
: Page type (TO-92)
: Bag (TO-92)
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