MX1N5772 Ver la hoja de datos (PDF) - Microsemi Corporation
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MX1N5772 Datasheet PDF : 2 Pages
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SCOTTSDALE DIVISION
1N5772
Isolated Diode Array with
HiRel MQ, MX, MV, and MSP Screening Options
DESCRIPTION
These low capacitance diode arrays are multiple, discrete, isolated junctions fabricated
by a planar process and mounted in a 10-PIN package for use as steering diodes
protecting up to eight I/O ports from ESD, EFT, or surge by directing them to the positive
side of the power supply line and to ground (see figure 1). An external TVS diode may
be added between the positive supply line and ground to prevent overvoltage on the
supply rail. They may also be used in fast switching core-driver applications. This
includes computers and peripheral equipment such as magnetic cores, thin-film
memories, plated-wire memories, etc., as well as decoding or encoding applications.
These arrays offer many advantages of integrated circuits such as high-density
packaging and improved reliability. This is a result of fewer pick and place operations,
smaller footprint, smaller weight, and elimination of various discrete packages that may
not be as user friendly in PC board mounting.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
APPEARANCE
10-PIN Ceramic
Flat Pack
FEATURES
• Hermetic Ceramic Package
• Isolated Diodes To Eliminate Cross-Talk Voltages
• High Breakdown Voltage VBR > 60 V at 10 µA
• Low Leakage IR< 100nA at 40 V
• Low Capacitance C < 8.0 pF
• Options for screening in accordance with MIL-PRF-
19500/474 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers. For example, designate
MX1N5772 for a JANTX screen.
MAXIMUM RATINGS
• Reverse Breakdown Voltage of 60 Vdc (Note 1 & 2)
• Continuous Forward Current of 300 mA dc (Note 1 & 3)
• Peak Surge Current (tp=1/120 s) of 500 mA dc (Note 1)
• 400 mW Power Dissipation per Junction @ 25oC
• 500 mW Power Dissipation per Package @ 25oC (Note 4)
• Operating Junction Temperature range –65 to +150oC
• Storage Temperature range of –65 to +200oC
NOTE 1: Each Diode
NOTE 2: Pulsed: PW = 100 ms max; duty cycle <20%
NOTE 3: Derate at 2.4 mA/oC above +25oC
NOTE 4: Derate at 4.0 mW/oC above +25oC
APPLICATIONS / BENEFITS
• High Frequency Data Lines
• RS-232 & RS-422 Interface Networks
• Ethernet: 10 Base T
• Computer I/O Ports
• LAN
• Switching Core Drivers
• IEC 61000-4 Compatible (see circuit in figure 1)
61000-4-2 ESD : Air 15kV, contact 8kW
61000-4-4 (EFT) : 40A – 5/50 ns
61000-4-5 (surge): 12A 8/20 µs
MECHANICAL AND PACKAGING
• 10-PIN Ceramic Flat Pack
• Weight 0.25 grams (approximate)
• Marking: Logo, part number, date code and dot
identifying pin #1
• Carrier Tubes; 19 pcs (standard)
ELECTRICAL CHARACTERISTICS (Per Diode) @ 25oC unless otherwise specified
PART
NUMBER
1N5772
MAXIMUM
FORWARD
VOLTAGE
VF1
IF = 100 mA
(Note 1)
Vdc
1
MAXIMUM
FORWARD
VOLTAGE
VF2
IF = 500 mA
(Note 1)
Vdc
1.5
MAXIMUM
REVERSE
CURRENT
IR1
VR = 40 V
µAdc
0.1
MAXIMUM
CAPACITANCE
(PIN TO PIN)
Ct
VR = 0 V
F = 1 MHz
pF
8.0
MAXIMUM
FORWARD
RECOVERY TIME
tfr
IF = 500 mA
ns
40
MAXIMUM
REVERSE
RECOVERY TIME
trr
IF = IR = 200 mA
irr = 20 mA
RL = 100 ohms
ns
20
NOTE 1: Pulsed: PW = 300 µs +/- 50 µs, duty cycle <2%, 90 µs after leading edge.
Copyright 2003
5-03-2004 REV A
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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