28F128L18 Ver la hoja de datos (PDF) - Intel
Número de pieza
componentes Descripción
Lista de partido
28F128L18 Datasheet PDF : 106 Pages
| |||
Intel StrataFlash® Wireless Memory (L18)
4.1.2
Figure 7.
SCSP Package Ballout
The L18 wireless memory in QUAD+ ballout device is available in an 88-ball (80-active ball)
Stacked Chip Scale Package (SCSP) for the 128- and 256-Mbit devices. For Mechanical
Information, refer to Section 3.0, “Package Information” on page 12.
88-Ball (80-Active Ball) SCSP Package Ballout
1
2
3
4
5
6
7
8
A
DU
DU
DU
DU
B
A4
A18
A19
V SS F1 -V CC F2-V CC
A2 1
A11
C
A5
R-LB#
A23
VSS
S -CS 2
CLK
A2 2
A12
D
F-V PP ,
A3
A17
A24 F-V PE N R-W E # P1 -CS #
A9
A13
E
A2
A7
A25 F-W P # ADV #
A20
A1 0
A15
F
A1
A6
R-UB# F-RST# F-WE #
A8
A1 4
A16
G
A0
D8
D2
D10
D5
D13
W AIT F2-CE #
H
R-O E #
D0
D1
D3
D1 2
D14
D7 F2-OE #
J
S -CS 1# F1-O E #
D9
D11
D4
D6
D1 5
VCCQ
K
F1-CE # P 2-CS # F3-CE # S-V CC P -V CC F2-V CC V CCQ P-Mode
L
VSS
VS S V CCQ F1-VCC VS S
VSS
VSS
VSS
M
DU
DU
DU
DU
Legend:
T o p Vie w - B a ll Sid e D o w n
S R A M /P S R A M sp e cific
G lo b a l
F la sh s p e cific
April 2005
18
Intel StrataFlash® Wireless Memory (L18)
Order Number: 251902, Revision: 009
Datasheet
Share Link: 