PACKAGE OUTLINE
SOP-8 PACKAGE OUTLINE AND DIMENSIONS
ACT365
Rev 2, 10-Jan-13
SYMBOL
A
A1
A2
B
C
D
E
E1
e
L
θ
DIMENSION IN
MILLIMETERS
MIN MAX
1.350 1.750
0.100 0.250
1.250 1.650
0.310 0.510
0.100 0.250
4.700 5.100
3.800 4.000
5.800 6.200
1.270 TYP
0.400 1.270
0°
8°
DIMENSION IN
INCHES
MIN MAX
0.053 0.069
0.004 0.010
0.049 0.065
0.012 0.020
0.004 0.010
0.185 0.201
0.150 0.157
0.228 0.244
0.050 TYP
0.016 0.050
0°
8°
Note:
1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per end.
2. Dimension E does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side.
Active-Semi, Inc. reserves the right to modify the circuitry or specifications without notice. Users should evaluate each
product to make sure that it is suitable for their applications. Active-Semi products are not intended or authorized for use
as critical components in life-support devices or systems. Active-Semi, Inc. does not assume any liability arising out of
the use of any product or circuit described in this datasheet, nor does it convey any patent license.
Active-Semi and its logo are trademarks of Active-Semi, Inc. For more information on this and other products, contact
sales@active-semi.com or visit http://www.active-semi.com.
is a registered trademark of Active-Semi.
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