ACT366 Ver la hoja de datos (PDF) - Active-Semi, Inc
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ACT366 Datasheet PDF : 11 Pages
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ACT366
Rev 1, 14-Nov-12
ORDERING INFORMATION
PART NUMBER
ACT366YH-T
TEMPERATURE RANGE
-40°C to 85°C
PACKAGE PINS
SOP-8/EP
8
PACKING
METHOD
TAPE & REEL
TOP MARK
ACT366YH
PIN CONFIGURATION
PIN DESCRIPTIONS
SOP-8/EP
ACT366YH
PIN
1
2,4,7
8
6
5
3
EP
NAME
DESCRIPTION
SW
Switch Drive. Switch node for the external NPN transistor. Connect this pin to the external power
NPN’s emitter. This pin also supplies current to VDD during startup.
GND Ground.
BD Base Drive. Base driver for the external NPN transistor.
VDD Power Supply. This pin provides bias power for the IC during startup and steady state operation.
FB Feedback Pin. Connect this pin to a resistor divider network from the auxiliary winding.
Current Sense Pin. Connect an external resistor (RCS) between this pin and ground to set peak
CS current limit for the primary switch. The peak current limit is set by (0.396V × 0.9) / RCS. For more
detailed information, see Application Information.
Exposed Pad shown as dashed box. The exposed thermal pad should be connected to board
EP
ground plane and pin 4. The ground plane should include a large exposed copper pad under the
package for thermal dissipation (see package outline). The leads and exposed pad should be
flush with the board, without offset from the board surface.
Innovative PowerTM
-2-
www.active-semi.com
Copyright © 2012 Active-Semi, Inc.
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