ACT5880
Rev 2, 03-Sep-13
ABSOLUTE MAXIMUM RATINGSc
PARAMETER
VALUE
UNIT
CHGIN to GA (Continuous)
7
BATID, TH, ACIN, HFPWR, VSYS and nSTAT to GA
6
ODO1 to GLED
42
ODO2, ODO3 to GLED
5
ON6, ON9, REFBP, BBCIN, VALIVE, VBBAT, XTAL-, XTAL+, CLK32, VSEL,
VBAT, CHGLEV, SDA, SCL, PWRHLD, nIRQ, nRSTO, nPBSTAT, nPBIN, OUT1
6
and OUT2 to GA
XPOS, XNEG, YPOS, YNEG, AUX0, AUX1, AUX2, VD to GD
6
SW1 to GP1
SW2 to GP2
-0.3 to (VP1 + 0.3)
V
-0.3 to (VP2 + 0.3)
OUT3, SW3, FB3 to any GP3
42
OUT6 to GA
-0.3 to (INL6 + 0.3)
OUT7 to GA
-0.3 to (INL7 + 0.3)
OUT8, OUT9 to GA
-0.3 to (INL89 + 0.3)
OUT10, OUT11 to GA
-0.3 to (INL1011 + 0.3)
OUT12, OUT13 to GA
-0.3 to (INL1213 + 0.3)
Difference between any two ground groups: GP1, GP2, GP3, GLED, GD, GA
-0.3 to + 0.3
Junction to Ambient Thermal Resistance (θJA)
43
°C/W
Power Dissipation, TA=25 ˚C
Power Dissipation Degrading for TA>25 ˚C
2
W
25
mW/°C
Operating Junction Temperature (TJ)
-40 to 150
Operating Ambient Temperature range (TA)
Storage Temperature
-40 to 85
°C
-55 to 150
Lead Temperature (soldering for 10 sec.)
300
c: Do not exceed these limits to prevent damage to the device. Exposure to absolute maximum rating conditions for long periods may
affect device reliability. Functional operation at conditions other than the operation conditions specified is not implied. Only one absolute
maximum rating should be applied at any time.
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