MSM6882-3 Ver la hoja de datos (PDF) - Oki Electric Industry
Número de pieza
componentes Descripción
Lista de partido
MSM6882-3 Datasheet PDF : 15 Pages
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¡ Semiconductor
PACKAGE DIMENSIONS
DIP22-P-400-2.54
MSM6882-3/6882-5
(Unit : mm)
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.90 TYP.
14/15
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