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ADG919BCP Ver la hoja de datos (PDF) - Analog Devices

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ADG919BCP Datasheet PDF : 4 Pages
1 2 3 4
PRELIMINARY TECHNICAL DATA
ABSOLUTE MAXIMUM RATINGS1
(TA = +25°C unless otherwise noted)
VDD to GND
Inputs to GND
Input Power
-0.5 V to +4 V
-0.5 V to VDD + 0.3V
TBD dBm
Operating Temperature Range
Industrial (B Version)
–40°C to +85°C
Storage Temperature Range
–65°C to +150°C
Junction Temperature
+150°C
MSOP Package
θJA Thermal Impedance
CSP Package
θJA Thermal Impedance
Lead Temperature, Soldering (10seconds)
206°C/W
TBD°C/W
300°C
IR Reflow, Peak Temperature (<20 seconds)
+235°C
NOTES
1Stresses above those listed under “Absolute Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only and functional operation of the device
at these or any other conditions above those listed in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Only one absolute maximum rating may
be applied at any one time.
ADG918/ADG919
PIN CONFIGURATION
8-Lead MSOP (RM-8)
3x3mm CSP (CP-8)
VDD 1
CONTROL 2
ADG918/
ADG919
8 RF1
7 GND
GND 3 TOP VIEW 6 GND
(Not to Scale)
RFCommon 4
5 RF2
Model
ADG918BRM
ADG918BCP
ADG919BRM
ADG919BCP
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
ORDERING GUIDE
Package Descriptions
MSOP (Micro Small Outline Package)
Chip Scale Package
MSOP (Micro Small Outline Package)
Chip Scale Package
Branding
Package Options
RM-8
CP-8
RM-8
CP-8
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG919 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
REV. PrC
–3–

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