ADN2805
OUTLINE DIMENSIONS
Data Sheet
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
5.10
5.00 SQ
4.90
TOP VIEW
0.50
BSC
0.30
0.25
0.18
25
32
24
1
EXPOSED
PAD
PIN 1
INDICATOR
3.25
3.10 SQ
2.95
17
8
0.50
16
9
0.25 MIN
0.40
BOTTOM VIEW
0.30
0.05 MAX
0.02 NOM
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
Figure 17. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADN2805ACPZ
ADN2805ACPZ-500RL7
ADN2805ACPZ-RL7
EVAL-ADN2805EBZ
1 Z = RoHS Compliant Part.
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
32-Lead LFCSP_WQ
32-Lead LFCSP_WQ, Tape-Reel, 500 pieces
32-Lead LFCSP_WQ, Tape-Reel, 1,500 pieces
Evaluation Board
Package Option
CP-32-7
CP-32-7
CP-32-7
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2008–2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07121-0-3/12(B)
Rev. B | Page 16 of 16