ADT7320 Ver la hoja de datos (PDF) - Analog Devices
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ADT7320 Datasheet PDF : 25 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
VDD to GND
DIN Input Voltage to GND
DOUT Voltage to GND
SCLK Input Voltage to GND
CS Input Voltage to GND
CT and INT Output Voltage to GND
ESD Rating (Human Body Model)
Operating Temperature Range1
Storage Temperature Range
Maximum Junction Temperature, TJMAX
Power Dissipation2
16-Lead LFCSP3
Thermal Impedance4
θJA, Junction-to-Ambient (Still Air)
θJC, Junction-to-Case
IR Reflow Soldering
Peak Temperature (RoHS-Compliant
Package)
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
Time from 25°C to Peak Temperature
Rating
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
2.0 kV
−40°C to +150°C
−65°C to +160°C
150°C
WMAX = (TJMAX − TA)/θJA
37°C/W
33°C/W
220°C
260°C (0°C/−5°C)
20 sec to 40 sec
3°C/sec maximum
−6°C/sec maximum
8 minutes maximum
1 Sustained operation above 125°C results in a shorter product lifetime. For
more information, contact an Analog Devices, Inc., sales representative.
2 Values relate to package being used on a standard 2-layer PCB. This gives a
worst-case θJA and θJC.
3 TA = ambient temperature.
4 Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air cooled, PCB-
mounted components.
ADT7320
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. 0 | Page 5 of 24
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