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AG102-G

High Dynamic Range Gain Block

WJ Communications => Triquint 

AG102

High Dynamic Range Gain Block

The Communications Edge TM

Product Information

AG102-G (Green / Lead-free SOT-89 Package) Mechanical Information

This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 qC reflow temperature) and leaded

(maximum 245 qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.

Outline Drawing

Product Marking

The AG102-G will be marked with an “A1G”

designator. An alphanumeric lot code

(“XXXX-X” ) is also marked below the part

designator on the top surface of the package.

A “3” will be lasermarked in the upper right-

hand corner. The obsolete tin-lead package is

marked with an “A1” designator followed by

an alphanumeric lot code.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

Land Pattern

MSL / ESD Rating

ESD Rating: Class 1B

Value:

Passes 500V to <1000V

¥

Test:

Human Body Model (HBM)

Standard: JEDEC Standard JESD22-A114

ESD Rating: Class IV

Value:

Passes 1000V to <2000V

¥

Test:

Charged Device Model (CDM)

Standard: JEDEC Standard JESD22-C101

MSL Rating: Level 3 at +260¤ C convection reflow

Standard: JEDEC Standard J-STD-020

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper

performance of this device. Vias should use a .35mm

Thermal Specifications

MTTF vs. GND Tab Temperature

(#80 / .0135” ) diameter drill and have a final plated

thru diameter of .25 mm (.010” ).

Parameter

10000

Rating

2. Add as much copper as possible to inner and outer

layers near the part to ensure optimal thermal

Operating Case Temperature

Thermal Resistance, Rth (1)

-40 to +85 qC

88 qC/W

1000

performance.

3. Mounting screws can be added near the part to fasten

the board to a heatsink. Ensure that the ground /

Junction Temperature, Tj (2)

113 qC

thermal via region contacts the heatsink.

4. Do not put solder mask on the backside of the PC board

1. The thermal resistance is referenced from the hottest

100

in the region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material

part of the junction to the ground tab (pin 4).

and construction.

2. This corresponds to the typical biasing condition of

+5V, 70 mA at an 85¤ C case temperature. A

minimum MTTF of 1 million hours is achieved for

6. Use 1 oz. Copper minimum.

10

7. All dimensions are in millimeters (inches). Angles are

60 70 80 90 100 110

in degrees.

junction temperatures below 160 ¤ C.

Tab Temperature (°C)

Specifications and information are subject to change without notice.

WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com

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Page 6 of 6 June 2006

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