Special Handling Instructions for FBGA
Package
Special handling is required for Flash Memory prod-
ucts in FBGA packages.
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compro-
mised if the package body is exposed to temperatures
above 150°C for prolonged periods of time.
PIN CONFIGURATION
A0–A18 = 19 addresses
DQ0–DQ14= 15 data inputs/outputs
DQ15/A-1 = DQ15 (data input/output, word
mode),
A-1 (LSB address input, byte
mode)
BYTE# = Selects 8-bit or 16-bit mode
CE#
= Chip enable
OE#
= Output enable
WE#
= Write enable
RESET# = Hardware reset pin, active low
RY/BY# = Ready/Busy# output
VCC
= 3.0 volt-only single power supply
(see Product Selector Guide for
speed
options and voltage supply
tolerances)
VSS
= Device ground
NC
= Pin not connected internally
LOGIC SYMBOL
19
A0–A18
16 or 8
DQ0–DQ15
(A-1)
CE#
OE#
WE#
RESET#
BYTE#
RY/BY#
Am29LV800B
9